POP mounting rework equipment - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

POP mounting rework equipment Product List

1～2 item / All 2 items

Displayed results

POP implementation and rework

Proposal based on the concept of new POP implementation! It can reduce the package footprint after implementation.

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing
POP mounting rework equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

POP Implementation and Rework [Case Study Introduction]

Supports upper and lower exchanges! POP implementation and rework are possible.

At K-All, we can handle POP implementation and rework. The PoP technology, which stands for "Package on Package," is a technique that allows for the stacking of ICs and components on top of an IC package. With the technology of POP implementation, BGA implementation with an interposer board is also possible. Compared to jumper wiring, QCD (Quality, Cost, Delivery) is improved. It enables low-cost evaluation and signal conversion for BGA. Through discussions between our customers and K-All's design team, we promise reliable QCD. 【Features】 ○ Capable of POP implementation and rework ○ If there are many correction points, we can propose POP implementation using an interposer board ○ We can consider and propose the merits and demerits of both jumper and interposer board options For more details, please contact us or download the catalog.